What alloys are used for board-level EMI shields?

Most EMI shields are made from copper alloy C194 (Cu-Fe-P) or C7025 (Cu-Ni-Si) — both etch cleanly in CuCl₂ etchant and accept tin or tin-lead plating afterwards. Tin-plated cold-rolled steel and copper-beryllium (Cu-Be 25, 10–12 µm thick) are common for RFI finger strips. We configure chemistry for any of these.

Why use photochemical etching instead of stamping?

Photo etching gives flat, parallel sidewalls and burr-free edges — both critical for EMI shields. A burr on an RFI finger strip is a leak in the gasket; a stamped strip has burrs to be removed and the surface won't sit flat. Etching eliminates the deburr step entirely and holds ±0.02 mm geometry shot-to-shot.

What's the typical thickness range?

0.05–0.30 mm for board-level shields, 0.10–0.30 mm for shielding cans, 0.10–0.20 mm for finger-strip stock. The super thin-plate machine handles 0.02–0.10 mm RFI stock down to 30 g/m² areal density.

How fast can a line make board-level shields?

A 650 mm-wide GE horizontal precision etching line makes ≈ 600–1,400 shields/min on a typical 100 mm × 30 mm pattern, with frame-skeleton throughput (frame + scrap) about 4–6 m/min. Reel-to-reel lines run continuous strip at 4 m/min.

What about plating — can it be done inline?

Yes. Etching lines are built with optional inline modules for matte tin, tin-lead and nickel plating. After etching and stripping, the strip is rinsed and enters the plating cell; finished stock is rewound on the take-up reel ready for SMT pick-and-place.

Home/Etching Machines/EMI / RFI Shielding

EMI shielding etching machine

Photochemical etching for board-level shields, RFI finger strips, shielding cans, and gasket frames. Cu alloy C194 / C7025 / Sn-plated steel / Cu-Be — burr-free, ±0.02 mm, 0.05–0.30 mm thickness. Inline plating-ready. Exported to EMC-component manufacturers since 2003.

An EMI shield only works if the seam is continuous. Stamping leaves a burr that gaps the seam; laser melts the edge. Photochemical etching leaves a flat, burr-free, parallel edge — and sidewalls that meet at the same angle every shot. That's why board-level-shield volume buyers specify etched.

By product

EMI parts on GE etching lines

📱 Board-level shields (one-piece)

C194 / C7025 / Sn-plated steel. Pick-and-place ready. Inline plating.

🔌 RFI finger strips

0.05–0.20 mm Cu-Be, brass, or Sn-plated bronze. Half-etch bend.

📡 Shielding cans

0.10–0.30 mm Cu alloy; box-fold geometry from a single flat pattern.

🧲 Door / lid gaskets

0.20–0.50 mm stainless / Cu plating. Frame-skeleton throughput.

📐 5G / high-frequency shields

Low-copper-content C19210 for high-frequency attenuation. Custom pattern.

🛡 EV inverter / ECU shields

Steeper side-walls for high-current noise. Automotive volume.

Recommended configuration

Two EMI shield configurations

Reel-to-reel Reel-to-reel etching machine for EMI shielding production

Reel-to-Reel Etching Line

Strip width25–650 mm
Strip thickness0.05–0.30 mm
Line speed3.0–4.0 m/min
Pad tolerance±0.02 mm
Inline modulesMatte-Sn / Sn-Pb / Ni plating
Throughput≈1.5k shields / min @ 100mm pitch

For high-volume board-level shields, RFI strips and shielding cans.

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R&D / low-volume Precision horizontal etching machine for low-volume EMI shield production

Precision Horizontal Etching Machine

Etch area650 × 2000 mm batch
Pad tolerance±0.02 mm
EtchantCuCl₂ with auto regeneration
CabinetFRP/PVC, full exhaust

For new shield designs, prototyping and small batches.

View specs →

Alloys

EMI-shield alloy chemistry

Cu-Fe-P (C194)

Industry default for board-level shields. CuCl₂ etchant.

Cu-Ni-Si (C7025)

Higher strength, used for high-vibration applications.

Cu-Be (25 alloy)

RFI finger strip. Mild oxidiser + chelating chemistry.

Tin-plated cold-rolled steel

Lowest cost. FeCl₃ etchant; tin layer protects during storage.

Brass / phosphor bronze

Contact & shielding applications. CuCl₂ with inhibitor.

Cu-clad invar

Low CTE for high-frequency satellite / aerospace shields.

GE machine lineup

EMI-shield etching — pick the right machine

A reel-to-reel line + a sheet line covers 95% of EMI shield programmes.

GE-RTR650-S GE-RTR650 EMI shield etching line

GE-RTR650-S — Reel-to-Reel Shield Line

Continuous Cu/Cu-alloy strip etching with inline plating — the production workhorse.

Strip width	25–650 mm
Strip thickness	0.05–0.30 mm
Line speed	3.0–4.0 m/min
Pad tolerance	±0.02 mm
Etchant	CuCl₂ + electrolytic Cu recovery
Inline modules	Matte-Sn / Sn-Pb / Ag spot plating
Throughput	approx. 1.5 k shields / min @ 100 mm pitch

GE-JM650-H GE-JM650-H EMI shield prototype line

GE-JM650-H — Sheet Prototyping

For new shield designs and short batches. Same HMI as the production line.

Etching area	650 × 2000 mm
Power	11.5 kW / 380 V
Pad tolerance	±0.02 mm
Etchant	CuCl₂ with auto regeneration
Cabinet	FRP/PVC, full exhaust

Related etching lines & guides

Six things to read next — same chemistry, similar tolerances, or the next step in your process.

Building an EMI-shield etching line?

Send your part drawing, alloy and annual volume. We'll spec the etch module, the inline plating module and the throughput target.

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