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Spray etching machine

Horizontal spray photochemical etching lines for stainless, copper, aluminium and titanium. Single-side, double-side, oscillating-nozzle and conveyor systems — fresh etchant on every pass, ±0.02 mm, etch factor up to 4.0. The workhorse of every GE production line.

Spray etching is the production-grade cousin of immersion etching: pump-driven nozzles sweep fresh etchant across the panel at controlled pressure and oscillation, replacing spent liquor each pass. The result is faster etch, finer features and more consistent chemistry across the panel.

By configuration

GE spray etching machines

✲ Single-side spray

Entry-level. Etch one side, protect the other. Single etching

✲ Double-side spray

Two-side simultaneous. Halve etch time. DB series

✲ Reel-to-reel spray

Continuous strip fed from coil. Reel-to-reel

Recommended machine

DB-series double-side spray line

2-side simultaneous Double-sided spray etching machine

Double-Sided Spray Etching Machine

  • Working width650 mm × L
  • Nozzle oscillation12–18 cycles/min
  • Spray pressure0.8–2.5 bar (variable)
  • Etch factor1.5–2.5 (standard)
  • Throughput2.5–4.5 m/min

PCB etching, nameplates, decor panels, sign blanks.

±0.005 mm Precision vertical etching machine

Precision Vertical Spray Etching Machine

  • Etch size550 × 550 mm
  • Spray patternUpward + downward oscillating
  • Etch factor2.5–4.0
  • Min. feature≈ 0.05 mm
  • Best forSMT stencils, encoders

Where the finest features matter most.

Process science

Spray etch physics, in 5 numbers

📐 Nozzle pressure

0.8–2.5 bar at the orifice. Variable per panel.

📐 Oscillation rate

12–18 cycles/min. Faster = more refresh, sharper walls.

📐 Etchant flow

40–120 L/min per square meter of panel. Recirculated.

📐 Etch factor

1.5–2.5 standard; 2.5–4.0 on precision vertical.

📐 Sidewall slope

60–85° depending on feature density and chemistry.

📐 Edge burr

0 µm — flat, square edge from chemical dissolution.

GE spray etching machines

Spray etching machines on the GE lineup

All GE spray etching lines run the same chemistry cabinet, just with different spray architectures.

GE-TS650 (Turntable) GE-TS650 turntable spray etching machine

GE-TS650 Turntable — Single- & Double-Side

Compact turntable cabinet for plaques, signs, watch cases & small decorative parts.

Etching area650 × 650 mm (custom)
Power5.5 kW / 380 V
Spray pressure1–3 bar (variable)
Spray patternSingle-side or double-side via turntable
ControlsTemp, speed, pressure, network filter
CabinetPP, full exhaust, PLC + HMI
Dimension1650 × 1500 × 1550 mm

Process flow: Loading → Etching → Unloading.

GE-JM650 (Conveyor) GE-JM650 conveyor double-side spray line

GE-JM650 Conveyor — Double-Side Spray

Production-line double-side spray etching, continuous panel feed.

Power11.5–15 kW / 380 V
Etching width650 / 1000 / 1220 / 1550 mm
Spray motors4 kW × 2 sets, oscillating
Tolerance±0.02 mm
Thickness0.05–2.0 mm
Tank volume800 L
Dimension3850 × 1650 × 1550 mm

Process flow: Load → 2-chamber etch → recycle-water wash → city-water rinse → Unload.

GE-TS650 (Vertical) GE-TS650 vertical precision spray etching

GE-TS650 Vertical — Precision Spray

Top & bottom simultaneous spray. Highest etch factor on fine features.

Power5.5 kW / 380 V / 50 Hz
Etch area650 × 650 mm (custom)
SprayTop & bottom, oscillating, 4 kW
Thickness0.05–5.0 mm
Tank volume400 L
Dimension1850 × 1650 × 1550 mm

Etch factor 2.5–4.0 — sharpest sidewalls on STENCIL, encoder, stent work.

Building a spray etching line?

Tell us your metal, panel size and throughput target. We'll spec the single- vs double-side spray module, the nozzle configuration and the chemistry loop.