✲ Single-side spray
Entry-level. Etch one side, protect the other. Single etching
Horizontal spray photochemical etching lines for stainless, copper, aluminium and titanium. Single-side, double-side, oscillating-nozzle and conveyor systems — fresh etchant on every pass, ±0.02 mm, etch factor up to 4.0. The workhorse of every GE production line.
Spray etching is the production-grade cousin of immersion etching: pump-driven nozzles sweep fresh etchant across the panel at controlled pressure and oscillation, replacing spent liquor each pass. The result is faster etch, finer features and more consistent chemistry across the panel.
Entry-level. Etch one side, protect the other. Single etching
Two-side simultaneous. Halve etch time. DB series
Continuous strip at 1.5–4.5 m/min. Continuous etching
Higher etch factor on precision work. Precision horizontal
Continuous strip fed from coil. Reel-to-reel
±0.01 mm — stencils, encoder discs. Precision vertical
PCB etching, nameplates, decor panels, sign blanks.
Where the finest features matter most.
0.8–2.5 bar at the orifice. Variable per panel.
12–18 cycles/min. Faster = more refresh, sharper walls.
40–120 L/min per square meter of panel. Recirculated.
1.5–2.5 standard; 2.5–4.0 on precision vertical.
60–85° depending on feature density and chemistry.
0 µm — flat, square edge from chemical dissolution.
All GE spray etching lines run the same chemistry cabinet, just with different spray architectures.
Compact turntable cabinet for plaques, signs, watch cases & small decorative parts.
| Etching area | 650 × 650 mm (custom) |
| Power | 5.5 kW / 380 V |
| Spray pressure | 1–3 bar (variable) |
| Spray pattern | Single-side or double-side via turntable |
| Controls | Temp, speed, pressure, network filter |
| Cabinet | PP, full exhaust, PLC + HMI |
| Dimension | 1650 × 1500 × 1550 mm |
Process flow: Loading → Etching → Unloading.
Production-line double-side spray etching, continuous panel feed.
| Power | 11.5–15 kW / 380 V |
| Etching width | 650 / 1000 / 1220 / 1550 mm |
| Spray motors | 4 kW × 2 sets, oscillating |
| Tolerance | ±0.02 mm |
| Thickness | 0.05–2.0 mm |
| Tank volume | 800 L |
| Dimension | 3850 × 1650 × 1550 mm |
Process flow: Load → 2-chamber etch → recycle-water wash → city-water rinse → Unload.
Top & bottom simultaneous spray. Highest etch factor on fine features.
| Power | 5.5 kW / 380 V / 50 Hz |
| Etch area | 650 × 650 mm (custom) |
| Spray | Top & bottom, oscillating, 4 kW |
| Thickness | 0.05–5.0 mm |
| Tank volume | 400 L |
| Dimension | 1850 × 1650 × 1550 mm |
Etch factor 2.5–4.0 — sharpest sidewalls on STENCIL, encoder, stent work.
Six things to read next — same chemistry, similar tolerances, or the next step in your process.
Inline conveyorised etch + strip + dry →
Stainless / Cu gasket production on spray lines →
Board-level shields — spray etch volume work →
Heat shields & liners — spray + oscillate →
FeCl₃ spray process for SST →
CuCl₂ spray with electrolytic recovery →
Tell us your metal, panel size and throughput target. We'll spec the single- vs double-side spray module, the nozzle configuration and the chemistry loop.